<?xml version="1.0" encoding="UTF-8"?><rss version="2.0"><channel><title>chips.sanjay920.com</title><description>A nine-layer deep-dive on the AI hardware supply chain, from EUV to tokens.</description><link>https://chips.sanjay920.com/</link><item><title>L01 · EUV — How a tin droplet becomes a chip pattern.</title><link>https://chips.sanjay920.com/l/01-euv/</link><guid isPermaLink="true">https://chips.sanjay920.com/l/01-euv/</guid><description>A laser strikes tin droplets to make 13.5 nm light. That light prints the smallest features on advanced logic chips.</description><pubDate>Wed, 13 May 2026 00:00:00 GMT</pubDate><category>EUV Lithography</category><category>λ 13.5 nm · watts</category></item><item><title>L02 · Wafer — How many useful accelerator dies fit on one wafer?</title><link>https://chips.sanjay920.com/l/02-wafer/</link><guid isPermaLink="true">https://chips.sanjay920.com/l/02-wafer/</guid><description>A 300 mm wafer offers many candidate reticle sites, but edge exclusion and defects reduce the number of good large dies.</description><pubDate>Wed, 13 May 2026 00:00:00 GMT</pubDate><category>Wafer Fabrication</category><category>858 mm² · % yield</category></item><item><title>L03 · Packaging — Why packaging matters as much as the chip.</title><link>https://chips.sanjay920.com/l/03-packaging/</link><guid isPermaLink="true">https://chips.sanjay920.com/l/03-packaging/</guid><description>The package connects compute dies to HBM through substrates, bridges, and interposers. Those layers determine bandwidth and yield.</description><pubDate>Wed, 13 May 2026 00:00:00 GMT</pubDate><category>Advanced Packaging</category><category>μm stack height · mm shoreline</category></item><item><title>L04 · HBM — How HBM gets to 2.5 TB/s.</title><link>https://chips.sanjay920.com/l/04-hbm/</link><guid isPermaLink="true">https://chips.sanjay920.com/l/04-hbm/</guid><description>Stacked DRAM, a base die, and thousands of IO lines add up to the bandwidth modern accelerators depend on.</description><pubDate>Wed, 13 May 2026 00:00:00 GMT</pubDate><category>HBM Memory</category><category>GB/s · TSVs · 12-high</category></item><item><title>L05 · Accelerator — Why modern accelerators are becoming multi-die systems.</title><link>https://chips.sanjay920.com/l/05-accelerator/</link><guid isPermaLink="true">https://chips.sanjay920.com/l/05-accelerator/</guid><description>The accelerator is no longer just one rectangle of silicon. It is a tightly integrated package of logic, memory interfaces, and die-to-die links.</description><pubDate>Wed, 13 May 2026 00:00:00 GMT</pubDate><category>Accelerator Die</category><category>transistors · tFLOPS</category></item><item><title>L06 · Scale-Up — How 72 GPUs behave like one machine.</title><link>https://chips.sanjay920.com/l/06-scale-up/</link><guid isPermaLink="true">https://chips.sanjay920.com/l/06-scale-up/</guid><description>NVL72 combines compute trays, switches, copper links, power, and cooling into a rack-scale training unit.</description><pubDate>Wed, 13 May 2026 00:00:00 GMT</pubDate><category>Scale-up Rack</category><category>GPUs / pod · NVLinks</category></item><item><title>L07 · Data Center — What it takes to power a dense AI data center.</title><link>https://chips.sanjay920.com/l/07-data-center/</link><guid isPermaLink="true">https://chips.sanjay920.com/l/07-data-center/</guid><description>As racks get denser, data-center design shifts from floor space to substations, conversion losses, and cooling.</description><pubDate>Wed, 13 May 2026 00:00:00 GMT</pubDate><category>Data Center</category><category>MW · PUE</category></item><item><title>L08 · Cloud — How hardware becomes cloud revenue.</title><link>https://chips.sanjay920.com/l/08-cloud/</link><guid isPermaLink="true">https://chips.sanjay920.com/l/08-cloud/</guid><description>This layer connects spending on compute infrastructure to rental pricing, utilization, and payback time.</description><pubDate>Wed, 13 May 2026 00:00:00 GMT</pubDate><category>Cloud Layer</category><category>$ / hr-Hopper · depreciation</category></item><item><title>L09 · AI Lab — How tokens inherit the cost of everything underneath them.</title><link>https://chips.sanjay920.com/l/09-ai-lab/</link><guid isPermaLink="true">https://chips.sanjay920.com/l/09-ai-lab/</guid><description>The lab is where the hardware supply chain turns into a user-facing service, with compute cost flowing into every token served.</description><pubDate>Wed, 13 May 2026 00:00:00 GMT</pubDate><category>AI Lab → Model</category><category>tokens / s · gross margin</category></item></channel></rss>